Disco Corporation (DISPF)
PNK · Technology · Semiconductor Equipment & Materials
Closing price as of 2026-06-12 · Source: TEK2day Finance
Key Metrics
About Disco Corporation
Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. Its precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws. The company also offers precision processing tools, such as dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, cut-off wheels, and related products. In addition, it is involved in the maintenance, disassembly, and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its machines. Further, the company leases precision machines; and purchases and sells used machines. Additionally, it manufactures and sells precision diamond abrasive tools; and offers chargeable processing services. The company was founded in 1937 and is based in Tokyo, Japan.
Quarterly Financials
| Metric | 2025-06-30 |
|---|---|
| Diluted EPS | $218.54 |
Annual Financials
| Metric | 2023-03-31 | 2024-03-31 | 2025-03-31 | 2026-03-31 |
|---|---|---|---|---|
| Revenue | 284.1B | 307.6B | 393.3B | |
| Gross Profit | 184.5B | 208.6B | 277.6B | |
| Operating Income | 110.4B | 121.5B | 166.8B | |
| Net Income | 82.9B | 84.2B | 123.9B | |
| Diluted EPS | $762.98 | $777.29 | $1,143.26 | $1,249.84 |